Analysis of Ground Void Patterns for Differential Microstrip Impedance Matching on Surface Mount Pads

Kuan-Ting Wu, Hank Lin, Bin-Chyi Tseng, Jackson Yen

DOI

10.17023/9g0a-vp48

EMC

Members: Free
IEEE Members: $11.00
Non-members: $15.00

Length: 00:11:35

29 Sep 2021

Chairs:

Prof. Er-Ping Li

Tags:

signal integrity and power integrity

More Like This

Research on Vehicle AC Charging EMC Test Method for Isolating the Influence of Charging Equipment

30 Sep 2021

Research on Vehicle AC Charging EMC Test Method for Isolating the Influence of Charging Equipment

EMC

Members: Free
IEEE Members: $11.00
Non-members: $15.00

Source and Load Impedance Mismatch Analysis of a Power Line Filter in Microgrid Application

30 Sep 2021

Source and Load Impedance Mismatch Analysis of a Power Line Filter in Microgrid Application

EMC

Members: Free
IEEE Members: $11.00
Non-members: $15.00

QnA of TC-02 - Day 4 Room 2 - 10:20 - 12:00

30 Sep 2021

QnA of TC-02 - Day 4 Room 2 - 10:20 - 12:00

EMC

Members: Free
IEEE Members: $11.00
Non-members: $15.00