Application of IEEE-370 for PCIe Interconnect Test with 2X-Thru De-Embedding
Se-Jung Moon, Xiaoning Ye, Kai Wang, Umair Khan, Timothy Wig
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EMC
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When PCIe 5.0 CEM connector testing result came out differently depending on the 2X-Thru de-embedding tools, we performed the tool accuracy test adopting the IEEE 370 specification and the framework. The key to success in this test was to ensure that the actual values of DUT (Device Under Test) were known and the qualities of data in use were good. Hence, we utilized PCIe 5.0 CEM connector and fixture model data for the direct comprehension in the compliance test and 370 plugand- play module data which provided the DUT direct measurement data. Best utilizing the metrics and criteria defined in 370 specification, four different states of art 2X-Thru de-embedding tools were tested, and the test results are summarized.